Ho presentato la mia candidatura tramite l'università. La procedura ha richiesto una settimana. Ho sostenuto un colloquio presso Works Applications (Hong Kong) nel mese di mar 2018
Colloquio
2 leetcode question 1 easy + 1 med
One is reverse a tree and another is a dynamic programming problem.
Sovled easy one quickly.
Get some trouble in medium one. No hint but interviewer asked me to calm down.
Passed.
Ho sostenuto un colloquio presso Works Applications (Tokyo)
Colloquio
Two interviews with two employees each times.
The interviews completed within a week timeframe.
The return is pretty quick. You will hear from them within 2-3 days after the interview.
Ho sostenuto un colloquio presso Works Applications (Tokyo)
Colloquio
First, there was an application screening. There were individual aptitude tests, group discussions, etc. After being selected for an internship, you will be hired if you achieve good results in the internship. You need to show even better results in the first training program after being hired and present what you want to be in your desired position at the drafting session.
Domande di colloquio [1]
Domanda 1
You will not be asked for your motivation, but you will need to explain what you hope to accomplish.
La procedura ha richiesto 2 settimane. Ho sostenuto un colloquio presso Works Applications
Colloquio
there were 3 interviews in total: one hackerrank interview, one live coding and one HR. the interviewers are quite nice and each one of them took about 1-1.5 hours because there were a lot of discussions
