Ho presentato la mia candidatura tramite l'università. Ho sostenuto un colloquio presso iLenSys nel mese di gen 2023
Colloquio
It consists of two rounds,both are technical interviews , first round is about fundamentals in the core subjects and it is a elimination round. Second round is about depth in the core subjects and it is also a elimination round,it is very difficult compared to the first round.
Domande di colloquio [1]
Domanda 1
Questions are about the core subjects mentioned in the resume
Ho presentato la mia candidatura tramite un'agenzia di reclutamento personale. La procedura ha richiesto 2 settimane. Ho sostenuto un colloquio presso iLenSys (Hyderabad) nel mese di ago 2019
Colloquio
Schematic symbols creation using OrCAD Capture 17.2
Bill Of material and net list creation
Footprint creation considering IPC Standard.
Net list Importing to the Layout
Setting up the DRC rule as per PCB Fabricator capability
Placement of the layout (as per Routing, Placement Guidelines)
Checking the Layout with QC Engineers
Preparation of Gerber, NC Drill files for PCB fabrication
Support to PCB manufacturer regarding Stack up as this board having high speed, multiple impedance requirements and metal core PCB
Ho sostenuto un colloquio presso iLenSys (Hyderabad) nel mese di lug 2012
Colloquio
It consisted of two rounds.
First round was a written test. It consisted of fundamental questions.
Second round was Technical & personal interview.
In the second round they asked questions like
tell me about yourself and then questions based on resume like describe about your project, can you show us how first angle projection is represented. basic questions of drawing.