Ho presentato la mia candidatura tramite l'università. La procedura ha richiesto un giorno. Ho sostenuto un colloquio presso thyssenkrupp (Mumbai) nel mese di nov 2019
Colloquio
It was an on-campus placement interview. The process had 3 parts: 1. Written Test - General Aptitude & Technical (was easy) 2. Group discussion round 3. Personal Interview (Technical as well as HR). The interview panel consisted of 1 person from technical and 2 from HR.
Domande di colloquio [1]
Domanda 1
1. Introduce yourself.
2. Questions related to internship, projects undertaken
3. Situation based technical questions about pumps, heat exchangers etc
4. Which pipeline material would be better in terms of corrosion
4x Runden, enttäuschende Angebot, viel niedriger als wir das in den ersten Runde besprochen haben.
Argumente: Bonus bis zu 30%, Flugmeilen darf ich behalten :)
Fand lächerlich und sehr enttäuschend, sie behandeln die Bewerber einfach nicht fair.
Domande di colloquio [1]
Domanda 1
Bereitschaft für 60% reisen, ohne die Zeit aufzuschreiben?
Ho presentato la mia candidatura online. La procedura ha richiesto 4 giorni. Ho sostenuto un colloquio presso thyssenkrupp (Fort Worth, TX) nel mese di lug 2017
Colloquio
Easy, the interview was in Spanish, because the CEO is from Spain. The manager from human resources and the CEO interview me. It was straight forward questions, They did not get me for that position in specific, but they hired me for the process engineer position.
