Ho presentato la mia candidatura di persona. Ho sostenuto un colloquio presso 3dplm Software Solution (Hinjewadi)
Colloquio
Well organized, smooth and transparent. Easy follow ups and feedback. No delays in response.Techical rounds happens in sequence of difficulty and technology experience. Brief about current role and responsibilities helps to give direction to the interview process
Ho presentato la mia candidatura online. La procedura ha richiesto 2 settimane. Ho sostenuto un colloquio presso 3dplm Software Solution (Poona)
Colloquio
First round is technical, Questions related to catia architecture, C++, math were asked. Classes, Functions were asked. Basic geometry related questions were also asked. Second round is also technical, Third round was HR.
Domande di colloquio [1]
Domanda 1
questions on catia architecture, c++, math questions
Ho presentato la mia candidatura tramite un selezionatore. La procedura ha richiesto una settimana. Ho sostenuto un colloquio presso 3dplm Software Solution (Poona) nel mese di ago 2022
Colloquio
There basically 3 rounds of interview. First one aptitude + coding round. Second will be technical interview and final will be hr round.
Aptitude round consist of MCQ question based on mathematics and consist of 2 coding problems.
Domande di colloquio [1]
Domanda 1
What is collection and different types of collections?