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      Colloqui di AmazonColloqui per Applied Scientist II presso AmazonColloquio di Amazon


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      Colloquio per Applied Scientist II

      8 giu 2022
      Candidato anonimo a colloquio
      Sunnyvale, CA
      Offerta rifiutata
      Esperienza negativa
      Colloquio nella media

      Candidatura

      Ho presentato la mia candidatura online. La procedura ha richiesto 5 settimane. Ho sostenuto un colloquio presso Amazon (Sunnyvale, CA) nel mese di apr 2022

      Colloquio

      The first Screening Interview was with a member of the team. It was several technical questions about computer vision and one leetcode medium problem in coderpad that was relevant to CV (think matrix manipulation). I mostly solved it with a few hints. Technical questions were broad and did not get very deep. The Onsite Interview was five 1-hour rounds. The offer was very high (30% higher than comparable positions at other companies), but the horror stories of long work weeks and the danger of PIP steered me toward a lower paying role that I think I'd be happier in.

      Domande di colloquio [1]

      Domanda 1

      - First round was a ~45-min presentation on a prior project. - One design question with the hiring manager seeing how I would approach the problem they are working on. This was the most technically difficult interview - One leetcode medium question with a software engineer. - Other rounds were a mix of behavioral questions and technical questions about CV/ML. - Each round had multiple behavioral questions (maybe half the time or more). I could tell they wanted me to be specific on my direct involvement and were gauging both how well I handled certain situations and how I could explain my core values. Overall not a very difficult interview, as long as you have solid examples for the behavioral questions/leadership principles. The technical aspect was actually far easier than several other non-FAANG companies I interviewed with.
      Rispondi alla domanda
      1

      Altre recensioni di colloqui per Applied Scientist II presso Amazon

      Colloquio per Applied Scientist II

      7 giu 2026
      Candidato anonimo a colloquio
      Seattle, WA
      Nessuna offerta
      Esperienza positiva
      Colloquio nella media

      Candidatura

      Ho presentato la mia candidatura tramite un selezionatore. Ho sostenuto un colloquio presso Amazon (Seattle, WA) nel mese di giu 2026

      Colloquio

      This interview was for the Applied Scientist Position at Amazon. It was a Science breadth/Depth as well as 1 easy LC problem. After that did a full loop interview. 1 Science ML Breadth, 1 Science Depth, 1 Sys Design (Team-specific), 1 coding round and 1 Bar Raiser

      Domande di colloquio [1]

      Domanda 1

      Bias-Variance tradeoffs. Bagging Vs boosting. Modeling details in my project. Basic Statistical Questions. DSA: String compression problem.
      Rispondi alla domanda

      Colloquio per Applied Scientist II

      7 apr 2026
      Candidato anonimo a colloquio
      Hyderabad
      Nessuna offerta
      Esperienza positiva
      Colloquio difficile

      Candidatura

      Ho sostenuto un colloquio presso Amazon (Hyderabad)

      Colloquio

      1 HR round 4 technical interviews (coding+depth+breadth) of Machine Learning. 1 round to go into depth of my own projects. 1 round on general data science questions + system design (model a pipeline end-to-end for translating one set of multimodal objects to another language)

      Colloquio per Applied Scientist II

      27 feb 2026
      Dipendente anonimo
      Santa Monica, CA
      Offerta accettata
      Esperienza neutra
      Colloquio nella media

      Candidatura

      Ho sostenuto un colloquio presso Amazon (Santa Monica, CA)

      Colloquio

      Two easy Leetcode problems, some ML coding problems and a lot of Leadership Principles talk. Overall average experience. A lot of middle managers not much room to innovate or take risks. Like working for the DMV

      Domande di colloquio [1]

      Domanda 1

      Write a program to calculate AUC
      Rispondi alla domanda