Ho presentato la mia candidatura tramite l'università. La procedura ha richiesto 5 giorni. Ho sostenuto un colloquio presso Amazon (Bengaluru) nel mese di feb 2023
Colloquio
The interview process was smooth, and I got timely mails about the process and interview slots. There were 2 rounds. In the first round I was asked 2 questions from DSA and in the second round I was asked about machine learning concepts in great depth.
Domande di colloquio [1]
Domanda 1
In the 1st round I was given a standard stack based question. The question was to find the next rgeatest element in an array along with one other question. In the 2nd round, I was asked about random forest classifiers and RNNs.
I was asked basic knowledge in deep learning and machine learning. Also had time of explaining my research. discussed how I can apply my research to the current project. Transformer architecture, bias-var tradeoff, use of positional encoding, long-term dependencies.
HackerRank assessment with solid, fair questions. Communication with the recruiting team was clear and professional throughout the process. I was invited to two additional interviews, one focused on research depth and the other on coding skills.
One phone screen on LeetCode-style medium coding question plus behavioral questions. One loop of three back to back interviews including one round of coding, two rounds of research plus behavioral questions.