Ho presentato la mia candidatura tramite l'università. La procedura ha richiesto un giorno. Ho sostenuto un colloquio presso HP Inc. (Bengaluru) nel mese di set 2023
Colloquio
Medium level DSA questions- linked list, arrays, strings, stacks, queues, differences
Networking -Osi layers, ipv4, ipv6, protocols of all layers
Cloud computing -AWS
Operating system- virtual memory utilization, CPU scheduling algorithms, threading, semaphores, deadlock
1 round with code test and project details. All process is onsite.
Code test is from leetcode hot 100 and other basic C language questions.
Generally it is quite easy and smooth
Ho presentato la mia candidatura tramite l'università. La procedura ha richiesto 5 settimane. Ho sostenuto un colloquio presso HP Inc. (Gorakhpur, Uttar Pradesh) nel mese di nov 2023
Colloquio
The first round is basically an assessment round in which they ask some coding & some question of aptitude. I have cleared the first round. The second round is Technical round in which they asked some question of core subject (OS,DBMS,OOPS) & some DSA question. I have cleared the second round. The Third round is Managerial Round in which they asked some question of puzzle & i am unable to solve that puzzle. I am unable to clear the third round.
