1 round with code test and project details. All process is onsite.
Code test is from leetcode hot 100 and other basic C language questions.
Generally it is quite easy and smooth
Ho presentato la mia candidatura tramite l'università. La procedura ha richiesto 5 settimane. Ho sostenuto un colloquio presso HP Inc. (Gorakhpur, Uttar Pradesh) nel mese di nov 2023
Colloquio
The first round is basically an assessment round in which they ask some coding & some question of aptitude. I have cleared the first round. The second round is Technical round in which they asked some question of core subject (OS,DBMS,OOPS) & some DSA question. I have cleared the second round. The Third round is Managerial Round in which they asked some question of puzzle & i am unable to solve that puzzle. I am unable to clear the third round.
Ho presentato la mia candidatura tramite l'università. La procedura ha richiesto un giorno. Ho sostenuto un colloquio presso HP Inc. (Bengaluru) nel mese di set 2023
Colloquio
Medium level DSA questions- linked list, arrays, strings, stacks, queues, differences
Networking -Osi layers, ipv4, ipv6, protocols of all layers
Cloud computing -AWS
Operating system- virtual memory utilization, CPU scheduling algorithms, threading, semaphores, deadlock
