Ho presentato la mia candidatura tramite l'università. La procedura ha richiesto 4 settimane. Ho sostenuto un colloquio presso Microsoft (Atlanta, GA) nel mese di set 2016
Colloquio
Met recruiters at campus career fair and was invited to participate in a case competition. About a week after the competition, received an email to sign up for an on-campus first round interview.
Domande di colloquio [1]
Domanda 1
Interview was super laid back. No specific questions. I had brought some of my work from a previous internship, so we talked about that.
Ho presentato la mia candidatura tramite l'università. La procedura ha richiesto 4 settimane. Ho sostenuto un colloquio presso Microsoft (Redmond, WA) nel mese di nov 2019
Colloquio
Got a first round interview with a recruiter from a university recruiting fair (behavioral interview). Mostly just 'why Microsoft' and asked about my background/resume.
Then got asked to fly out to Seattle (Redmond Campus) for onsite. There was an optional pre-meet dinner with current Microsoft employees. It was basically a big networking event and actually got to meet some of the employees that would interview me the next day. Was on the campus from 10-5. From 10-1, we had lunch and a lab tour. From 1-4 we had scheduled 45 minute technical interviews.
Ho presentato la mia candidatura online. La procedura ha richiesto 2 mesi. Ho sostenuto un colloquio presso Microsoft
Colloquio
Applied online through for the position and was contacted by a recruiter about a month later saying that they wanted to do an oncampus first round interview. The interview was with a ME and was mostly technical with a couple questions like "why microsoft" etc.
Heard back later in the week that they wanted to fly me up to Seattle for a final round interview. They flew me out and I had 4 interviews in 4 hours (1 hour each) all morning. All of the interviews were mostly the same (about 30 minutes of technical questions and 30 minutes for personality questions and my own questions about Microsoft). Pretty standard mechanics of materials and thermal design questions
