Ho presentato la mia candidatura tramite l'università. La procedura ha richiesto 6 settimane. Ho sostenuto un colloquio presso Microsoft (Madison, WI) nel mese di ott 2017
Colloquio
First round was held on campus and it was a mix of both behavioral and technical. I was called for the second round in Redmond, where Microsoft headquarters is located. The second round interview consisted of 4 rounds each 45 minute long. Overall, the interview process was smooth.
Domande di colloquio [1]
Domanda 1
Name one technical challenge you have encountered in your field of study
Ho sostenuto un colloquio presso Microsoft (Seattle, WA)
Colloquio
Straightforward technical loop overall, with strong interviewers at every stage. I genuinely enjoyed the in-depth conversations around technical challenges and algorithmic problem-solving — the entire process felt well-structured and genuinely engaging.
Ho presentato la mia candidatura tramite segnalazione di un dipendente. Ho sostenuto un colloquio presso Microsoft (Bangalore Rural) nel mese di giu 2026
Colloquio
The interview was hard, even as a fresher the dsa they asked was hard category after I checked on leetcode. Though I couldn't solve it. Some of the other people who interviewed were asked easy - medium dsa
The interview was a long process. There was first the recruiter screen, which was followed by a 4-loop interview structure that covered technical, behavioral, and system design. The interviewers were very kind and accommodating.
Le migliori aziende per "stipendio e benefit" vicino a te
