Ho presentato la mia candidatura tramite un selezionatore. La procedura ha richiesto una settimana. Ho sostenuto un colloquio presso Microsoft (Redmond, WA) nel mese di set 2019
Colloquio
Had a first round phone interview for internship position. The interviewer called me and since it was a 30 min interview, it was mainly just technical questions. This was more of a general interview targeted at many positions.
The interview started with a deep dive into my C, RTOS, and debugging skills. I shared my hardware project experience and walked the team through resolving a tricky memory leak.
Ho presentato la mia candidatura tramite l'università. Ho sostenuto un colloquio presso Microsoft (Greater Noida)
Colloquio
Basics of embedded software. HAL, BSP and C expert questions. It was very good interview questions for firmware development engineer related to work. Mostly question were asked from the project done and experience.
Ho sostenuto un colloquio presso Microsoft (Hyderabad)
Colloquio
Good and mainly on data structures and bios
Hard to medium level questions
Overall great experience
Need to prepare well
There is no cooling period
You can apply to other posts while giving interviews to other role as well
