Ho presentato la mia candidatura tramite l'università. La procedura ha richiesto una settimana. Ho sostenuto un colloquio presso Microsoft (Redmond, WA) nel mese di mag 2011
Colloquio
Applied through career fair. School interview, followed by phone interview and then on-site interview done by 5-6 people. Then you'll hear back from them in a week or two. After 3 months doing internship, I got a full-time offer. You can end up in any hardware program without your knowing so if you know what exactly you want to do make sure to convey that during your internship.
Domande di colloquio [1]
Domanda 1
- What is OpAmp?
- BJT and MOSFET Large-Signal Questions?
- How can you improve wending machine
- Questions on your expereinces listed on your resume
Ho sostenuto un colloquio presso Microsoft (Taipei)
Colloquio
Not too technical, only a few simple oral questions about coding skills. Other questions are behavioral, such as asking what's your biggest challenge so far or what is your strength/weakness.
Ho sostenuto un colloquio presso Microsoft (Seattle, WA)
Colloquio
I was directly invited to the final round. Three sessions followed, each lasting 45 minutes, with a 15-minute break between them. It was a rigorous process but an exciting experience overall.
Ho presentato la mia candidatura online. Ho sostenuto un colloquio presso Microsoft
Colloquio
Took about month to hear from them. Email described that your papers have been read and your interview is being scheduled. Next week the recruiter invites to a meeting the next day. 1st meeting with the recruiting manager. Sadly not invited to proceed. I was asked during the interviewing about skills that I did not have.
Domande di colloquio [1]
Domanda 1
Have you been been in charge of installation/investment processes when getting new equipment?
