Ho presentato la mia candidatura tramite l'università. La procedura ha richiesto 4 mesi. Ho sostenuto un colloquio presso NVIDIA nel mese di mag 2016
Colloquio
Two rounds of phone interview. I submit my resume on the school's career fair in Feb 2016. It took more than two months for them to review. The first one was from hiring manger and the second one was from a colleague of the thermal engineering team.
Domande di colloquio [1]
Domanda 1
1, How do you know about the products of NVIDIA?
2, Background introduction
3, What was the difficult when you used high speed camera?
4, How do you decide whether a numerical simulation result is correct?
5, What is critical heat flux
6, Do you have experience in control system?
7, Water cooling and fan.
3 interviews, 2 managers, 1 director. Process was smooth and done in 3 weeks. All were a lot of design, heat transfer, and previous expereinces. Director waas very tough. Thanks.
Ho presentato la mia candidatura online. La procedura ha richiesto più di una settimana. Ho sostenuto un colloquio presso NVIDIA nel mese di gen 2025
Colloquio
There is just one interview with Hiring Manager and that is all for this position. During this interview, the Hiring Manager will assess the candidate’s qualifications, experience, and fit for the role and the company culture
Domande di colloquio [1]
Domanda 1
Tell me about yourself. What your experience with Heat Pipes?
Ho presentato la mia candidatura online. Ho sostenuto un colloquio presso NVIDIA nel mese di lug 2023
Colloquio
phone call (15 mins)>>professinal interview 1 (2 hrs)>>prifessinal interview 2 (2 hrs)>>hr interview (1 hr). two problems at each professinal interview, in the fisrt one they were more general and fundamental.