The process was a total of 2 technical interviews, each 2 hours long and another HR interview. First interview was with 2 senior engineers on the team and the second interview was with the Thermal Engineering Manager.
Domande di colloquio [1]
Domanda 1
What is the temperature distribution inside a metal rod exposed to hot air?
Ho presentato la mia candidatura online. La procedura ha richiesto 2 giorni. Ho sostenuto un colloquio presso NVIDIA (Santa Clara, CA) nel mese di gen 2024
Colloquio
45 minute video conference, where he asked mostly about the GPU heat analysis and heat sink, heat pipe, fan design techniques and analysis. he asked few about me and my projects and skills, softwares.