Ho presentato la mia candidatura tramite l'università. Ho sostenuto un colloquio presso Oracle nel mese di dic 2021
Colloquio
I had two rounds of interview. I was asked one hard level coding question. I had to explain and write the code. They also asked me run some sample test cases. The interviewer helped me understand the problem clearly. I started with naive approach and then went through the efficient approach. I wrote the code and explained with sample test cases. After the coding round, there's a short HR round.
Domande di colloquio [1]
Domanda 1
Coding question:
Split the given array into K sub-arrays such that maximum sum of all sub arrays is minimum
HR questions:
1) Why Oracle
2) Why should we hire you?
Ho sostenuto un colloquio presso Oracle (Redwood Shores, CA)
Colloquio
Technical phone screen, then onsite. Onsite was 3 separate interviews. Questions were average difficulty. I recommend studying leetcode so you are knowledgeable about DSA. I heard back next day with my offer.
The interview consisted of three technical rounds and one HR round, covering OS, DBMS, projects, internship experience, favorite data structures, linked lists, trees, TSP, OOPs concepts, Spring Boot, and Python libraries.
Ho presentato la mia candidatura tramite l'università. La procedura ha richiesto un giorno. Ho sostenuto un colloquio presso Oracle (Hyderabad) nel mese di dic 2025
Colloquio
Interview had 3 rounds 2 technical 1 hr round.interview was mostly on resume and dsa questions. Dsa questions were on linked list. Hr had some puzzles. Interviewers were very supportive and friendly.