Ho presentato la mia candidatura tramite l'università. La procedura ha richiesto 3 mesi. Ho sostenuto un colloquio presso Rakuten (Mumbai) nel mese di set 2019
Colloquio
The interview was very simple and straight forward. It had two parts: The technical part and the HR part. The technical round focused more on my undergraduate thesis and technical skills while the HR round focused on my interpersonal skills and my extracurricular history.
Domande di colloquio [1]
Domanda 1
Explain my role in my undergraduate project and the challenges faced and overcome during this project.
Ho presentato la mia candidatura online. La procedura ha richiesto 2 mesi. Ho sostenuto un colloquio presso Rakuten (Bengaluru) nel mese di feb 2020
Colloquio
Online test follwed by telephonic interview in which they asked about networks and topology which was their main ask as the role offered was of network engineer after the internship of 6 months in the same area for which they were offering 20k stipend per month
Ho presentato la mia candidatura online. La procedura ha richiesto 2 settimane. Ho sostenuto un colloquio presso Rakuten (Tokyo) nel mese di gen 2020
Colloquio
for me 2 interview process was there.
1 - technical interview
2 -HR interview
in techincal interview theya sked about the telco experince i have and industry trents oin telco s.
interviuew process was a smoother one
