Ho presentato la mia candidatura tramite l'università. La procedura ha richiesto 2 mesi. Ho sostenuto un colloquio presso Texas Instruments (Dallas, TX) nel mese di nov 2015
Colloquio
Met a recruiter at an on-campus career fair, and had an in person interview the next day. Two weeks later was contacted for a phone interview. Phone interview was half behavioral and half technical. Third interview was on-site in Dallas, TX. Requested to give a 15 minute technical presentation, followed by two hour long interviews with current employees.
Domande di colloquio [1]
Domanda 1
What is packaging engineering?
Describe the effect of the annealing process on microstructure of metals.