Domande di colloquio per Packaging Engineer Rotational Program (New Grad) presso Texas Instruments

Met a recruiter at an on-campus career fair, and had an in person interview the next day. Two weeks later was contacted for a phone interview. Phone interview was half behavioral and half technical. Third interview was on-site in Dallas, TX. Requested to give a 15 minute technical presentation, followed by two hour long interviews with current employees.