Ho presentato la mia candidatura tramite l'università. La procedura ha richiesto un giorno. Ho sostenuto un colloquio presso WD (Nuova Delhi) nel mese di set 2019
Colloquio
Written test MCQ, 3 PARTS 20 QUESTION EACH - C/C++ DS - APTITUDE - DIGITAL ELECTRONICS 2 Technical round after Written Mostly about the written test and explanation about right answer and process to get that answer. About project details in deep .
Domande di colloquio [1]
Domanda 1
2 Technical round after Written Mostly about the written test and explanation about right answer and process to get that answer. About project details in deep .
Ho presentato la mia candidatura online. Ho sostenuto un colloquio presso WD
Colloquio
Multiple rounds of interview. Questions mostly on storage technology and pcie, nvme and related technology. 3 rounds of technical and 1 round of HR interview. Multiple rounds of interview. Questions mostly on storage technology and pcie, nvme and related technology. 3 rounds of technical and 1 round of HR interview.
Ho presentato la mia candidatura tramite un selezionatore. La procedura ha richiesto 2 settimane. Ho sostenuto un colloquio presso WD (`Omer) nel mese di lug 2021
Colloquio
Test in a room with other candidates. afterwards a personal interview. The personal interview with the team leader and a team leader from another team. They were very nice and explained about the company and the job.
