Ho presentato la mia candidatura online. Ho sostenuto un colloquio presso WD
Colloquio
Multiple rounds of interview. Questions mostly on storage technology and pcie, nvme and related technology. 3 rounds of technical and 1 round of HR interview. Multiple rounds of interview. Questions mostly on storage technology and pcie, nvme and related technology. 3 rounds of technical and 1 round of HR interview.
Ho presentato la mia candidatura tramite un selezionatore. La procedura ha richiesto 2 settimane. Ho sostenuto un colloquio presso WD (`Omer) nel mese di lug 2021
Colloquio
Test in a room with other candidates. afterwards a personal interview. The personal interview with the team leader and a team leader from another team. They were very nice and explained about the company and the job.
Ho presentato la mia candidatura tramite l'università. La procedura ha richiesto un giorno. Ho sostenuto un colloquio presso WD (Nuova Delhi) nel mese di set 2019
Colloquio
Written test MCQ, 3 PARTS 20 QUESTION EACH - C/C++ DS - APTITUDE - DIGITAL ELECTRONICS 2 Technical round after Written Mostly about the written test and explanation about right answer and process to get that answer. About project details in deep .
Domande di colloquio [1]
Domanda 1
2 Technical round after Written Mostly about the written test and explanation about right answer and process to get that answer. About project details in deep .
