Ho presentato la mia candidatura online. La procedura ha richiesto 4 settimane. Ho sostenuto un colloquio presso Amazon (Seattle, WA) nel mese di ago 2019
Colloquio
Started with a phone screen by recruiter and he set me up for a technical screening with a Data Engineer at Amazon, jumped directly to tech questions after a short introduction and a behavioral question (which I wasn't expecting). I was tested on few easy - medium SQL queries, spark and dimensional modelling. Did ok, with the technical screening and then was later invited for onsite in couple of weeks. Onsite interview was exhausting, had 5 interviews back to back, mostly behavioral and ETL, Dimensional design questions on 4 interviews, last interview was mostly advanced sql with window functions, partitions, indexes and SCD's.
Domande di colloquio [1]
Domanda 1
SQL Queries (medium, ER Modelling, Partitions, Indexes
Ho presentato la mia candidatura online. Ho sostenuto un colloquio presso Amazon nel mese di giu 2026
Colloquio
Applied online. Got an OA. OA was not that difficulty, on the easier side to be honest. Got an email asking for interview availability.
Interview in a week. Will update soon.
Ho sostenuto un colloquio presso Amazon (Seattle, WA)
Colloquio
Very difficult process it took me a round 1 month to get back what’s the review for the interview so I think overall it’s bad experience and difficult interview process while it has lot of questions I wa able to answer
Ho sostenuto un colloquio presso Amazon (New York, NY)
Colloquio
Standard three-round process consisting of an online assessment followed by a comprehensive interview loop, where candidates were evaluated across technical skills, problem solving ability, and overall fit for the role.
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Le migliori aziende per "stipendio e benefit" vicino a te