Ho presentato la mia candidatura tramite l'università. La procedura ha richiesto un giorno. Ho sostenuto un colloquio presso Amazon (Hyderabad) nel mese di lug 2023
Colloquio
1 dsa round with 2 dsa problems (on campus) during internship.
The problems asked can be considered of the level of leetcode medium to hard (max to max). Some questions may also be about projects.
Domande di colloquio [1]
Domanda 1
Dynamic programming questions (dsa) and a graph problem.
Ho presentato la mia candidatura online. La procedura ha richiesto 5 settimane. Ho sostenuto un colloquio presso Amazon (Toronto, ON) nel mese di feb 2026
Colloquio
OA included hackerrank coding test, workplace simulation, and workstyle survery. after that was just final onsite, 4 rounds back to back. 2 algorithm questions, 1 LLD, and 1 bar raiser.
Ho sostenuto un colloquio presso Amazon (Seattle, WA)
Colloquio
Three rounds in total. First behavioral, second technical DSA coding, third Low Level Design. Interviewers were friendly, and questions were easy to crack. I would say preparing Amazon LPA is the best and sure-shot way to crack the interview.
Domande di colloquio [1]
Domanda 1
Was there a scenario where you went above and beyond for customer satisfaction?
Ho sostenuto un colloquio presso Amazon (Seattle, WA)
Colloquio
Good overall, great experience.
It was of 3 total rounds.
First assessment.
3 rounds of DSA and Behavioral.
Behavioral was mostly on the Leadership Principles.
Over all a goof experience.
